Wednesday, 27 April 2016

Liquid-metal particles enable heat-free soldering at room temperature

New liquid-metal particles that have practical applications in heat-free soldering and electronic circuit damage repair

Researchers at Iowa State University have produced novel micro-sized particles filled with liquid metal that retains its liquid state at room temperature and are able to meld with each other. The new form of liquid/solid hybrid has practical applications in heat-free soldering and electronic circuit damage repair.

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Category: Materials

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from Gizmag Emerging Technology Magazine http://ift.tt/1rjh71I

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